发明名称 |
Bonding pad structure and method thereof |
摘要 |
A structure and a process for forming an improved bonding pad which resists bond pad peeling of between the bonding pad layer and the underlying layers. The method comprises forming plurality of anchor pads on said substrate surface in a bonding pad area. Next, a first insulating layer is formed over said substrate surface and the anchor pads. Vias are formed through the first insulating layer. The vias are filled with a second metal layer making a connection to the anchor pads and the first insulating layer is covered in the bonding pad area with the second metal layer. It is important that the via holes have a smaller cross sectional area than the anchor pads so that the combination of the anchor pads and the second metal form small "hooks" into the first insulating layer that hold the second metal (bonding pad layer) to the underlying layer.
|
申请公布号 |
US5707894(A) |
申请公布日期 |
1998.01.13 |
申请号 |
US19950549629 |
申请日期 |
1995.10.27 |
申请人 |
UNITED MICROELECTRONICS CORPORATION |
发明人 |
HSIAO, MING-SHAN |
分类号 |
H01L23/485;(IPC1-7):H01L21/60 |
主分类号 |
H01L23/485 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|