发明名称 SPRAY-COOLING CIRCUIT BOARD APPARATUS
摘要 <p>The circuit board apparatus (10) includes a first layer (12, 14), a second layer (12, 14) and an inner plate (19) disposed between the first layer (12, 14) and the second layer (12, 14). A fluid distributing conduit (38) is disposed in the inner plate (19). The fluid distributing conduit (38) has a first end (22), a central portion (24) defining a chamber, and a second end (26). A first electronic component (28) is disposed within the chamber (24). A nozzle (60) is disposed in the fluid distributing conduit (38). The nozzle (60) receives a fluid, atomizes the fluid and discharges the atomized fluid (70) into the chamber (24).</p>
申请公布号 WO1998001015(A1) 申请公布日期 1998.01.08
申请号 US1997005341 申请日期 1997.03.27
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