| 摘要 |
<p>A substantially solvent-free molten or fluid desiccant/organic matrix composition is adhered to a package whereby the desiccant is in communication with a compartment of the resulting package such that the compartment is desiccated by the desiccant composition. The desiccant composition preferably contains a thermoplastic organic matrix, is heated before it is adhered to the package, and cools after application. In some instances, the desiccant matrix may be adhered to a component of the package contents. The package is preferably non-reclosable and suitable for holding an article such as a drug, medical device or electronic device.</p> |
