Electronic component handling method during final assembly

摘要

The electronic components (18) are handled during the final assembly in a testing and processing station such that they are transported through the station on carriers (10) with several retentions (14) for the individual components. In the station the components are mechanically removed from the retentions for testing and processing. The components are subsequently returned to the retentions after testing. Alternatively, they may be returned into the retainers of another carrier, while maintaining their relative arrangement.