发明名称 Methods and apparatus for treating workpieces with plasmas
摘要 <p>The disclosure relates to a plasma generator for the fabrication of integrated circuit devices (17). The generator (30) includes a separate plasma igniter electrode (31) to apply the electrical power to a gas within a treatment chamber (13) necessary to create a desired plasma. The plasma, once it is initiated, then is sustained by inductive coupling (36, 38). &lt;IMAGE&gt;</p>
申请公布号 EP0817237(A2) 申请公布日期 1998.01.07
申请号 EP19970116533 申请日期 1994.10.05
申请人 APPLIED MATERIALS, INC. 发明人 HANAWA, HIROJI
分类号 H05H1/46;C23F4/00;H01J37/32;H01L21/205;H01L21/302;H01L21/3065;(IPC1-7):H01J37/32 主分类号 H05H1/46
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