IC package, IC prober and connector and method of forming the same

摘要

The present invention provides an IC package comprising an IC chip substrate (25) having a first surface on which a plurality of electrodes (27) are formed, and an organic substrate (2) having a first surface on which a plurality of bump electrodes (24) are provided. The organic substrate (2) is combined with the IC chip substrate (25). Each of the bump electrodes is in contact with corresponding one of the electrodes (27) on the IC chip substrate (25). The organic substrate (2) has a plurality of through holes (3) and metallization patterns (9) electrically connecting each of the bump electrodes (24) to corresponding one of the through holes (3).