Circuit board and method of producing the same

摘要

There is provided a circuit board consisting of a substrate or lower insulation layer, a side insulation layer and a conductor wiring layer, wherein catalytic nuclei for plating are provided to an interface between a bottom surface of the conductor wiring layer and an upper surface of the lower insulation layer and to an interface between a side surface of the conductor wiring layer and a side surface of the side insulation layer. There is also provided a multi-layered circuit board including an insulation interlayer formed with a via for electrical connection between conductor wiring layers on the opposite sides of the insulation interlayer, wherein catalytic nuclei for plating are provided to an interface between a side surface of the via and the insulation interlayer. A method of producing such a circuit board is also provided. <IMAGE> <IMAGE>