| 摘要 |
The retention device has a carrier plate (7) with a recess (1) in its surface, for reception of the microelectronic component, e.g. an optical fibre (2), with an associated bridge structure (3,4) for holding it in place. The microelectronic component is displaced after insertion in the recess, up to the edge (5) of the latter, so that it fits under the bridge structure. Pref. the bridge structure is provided by at least one layer applied to the surface of the carrier plate, the carrier plate pref. formed of silicon and the applied layer of a nitride. |
