Apparatus and method for encapsulating products

摘要

Apparatus for encapsulating products, for instance encapsulating lead frames with epoxy resin, wherein the apparatus comprises: one or more pressing devices for encapsulating the products at increased pressure and/or temperature; a first carriage device for transferring the products from supply means to the pressing device; and a second carriage device for discharging the encapsulated products from the pressing device to discharge means, wherein the first and second carriage are guidable along collective guide means. <IMAGE>