发明名称 Semiconductor device and method of fabrication therefor
摘要 There are disclosed a semiconductor device and a method for fabrication thereof. The semiconductor device comprises an insulating film for well isolation which electrically insulates N-well from P-well, the drain electrode of PMOS and the drain electrode of NMOS being adjacent to the trench for well isolation, and a conductive wire filling one contact hole which interconnects the drain electrodes of N-well with those of P-well. The semiconductor device is very reduced in size, and thus, high integration thereof can be achieved.
申请公布号 GB2286082(B) 申请公布日期 1998.01.07
申请号 GB19950000995 申请日期 1995.01.19
申请人 * HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 JAE KAP * KIM
分类号 H01L21/28;H01L21/60;H01L21/762;H01L21/768;H01L21/8238;H01L27/092;(IPC1-7):H01L21/768;H01L21/76 主分类号 H01L21/28
代理机构 代理人
主权项
地址