| 发明名称 |
Lead-free, high tin ternary solder alloy of tin, silver, and indium |
| 摘要 |
A high solidus temperature, high service temperature, high strength ternary solder alloy, solder paste and method. The alloy contains a major proportion of tin of at least about 70% by weight, a selectively limited amount of silver from about 6.5 to about 7.5% by weight, balance indium. |
| 申请公布号 |
AU6279296(A) |
申请公布日期 |
1998.01.07 |
| 申请号 |
AU19960062792 |
申请日期 |
1996.06.13 |
| 申请人 |
IBM CORPORATION;CHARLES G. WOYCHIK;AMIT K. SARKHEL |
发明人 |
CHARLES G. WOYCHIK;AMIT K. SARKHEL |
| 分类号 |
B23K35/02;B23K35/26;C22C13/00;H05K3/34 |
主分类号 |
B23K35/02 |
| 代理机构 |
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代理人 |
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| 地址 |
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