发明名称 LEAD-THROUGH TYPE LAMINATED CHIP CAPACITOR
摘要 <p>PROBLEM TO BE SOLVED: To enable a lead-through type laminated chip capacitor to be lessened in inductance, enhanced in noise limiting properties and workability as to mounting, and capable of lessening an equipment in size by a method wherein the laminated chip capacitor is equipped with signal input/output terminal electrodes which function as electric resistors. SOLUTION: A lead-through type chip capacitor is equipped with signal input/output terminals 11 and 12 which function as electrical resistors. The chip capacitor is also equipped with grounding terminal electrodes 21 and 22, an inner signal input/output electrodes 31, and an inner grounding electrode 41 inside it. At this point, the signal input/output terminals 11 and 12 functioning as electrical resistors have a resistance of a few to hundreds ofΩeach to serve as dumping resistors. The terminals 11 and 12 are formed of material obtained by dispersing conductive material into insulating material so as to function as electrical resistors, wherein glass frit is used as insulating material, and RuO2 , Ag-Pd, MoO3 , TaN or LaB6 is used as conductive material.</p>
申请公布号 JPH104031(A) 申请公布日期 1998.01.06
申请号 JP19960153664 申请日期 1996.06.14
申请人 TDK CORP 发明人 TOGASHI MASAAKI;ISHIGAKI TAKAYA;MUTSUHIRA JUNICHI
分类号 H01C7/00;H01G4/35;(IPC1-7):H01G4/35 主分类号 H01C7/00
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