发明名称 ELECTRODE STRUCTURE FOR III-V COMPOUND SEMICONDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME
摘要 The present invention relates to an electrode structure formed on a III-V compound semiconductor element and a method for manufacturing the same and an object thereof is to provide an electrode which exhibits a high wire bonding strength, a low ohmic contact resistance, and high reliability, and is easy to shape itself. The electrode structure of the present invention is formed by annealing after the formation of a laminated structure having an ohmic layer including at least Ni formed on the III-V compound semiconductor element, a bonding layer to be connected with a bonding wire, a stopper layer provided between the ohmic layer and the bonding layer and an isolation layer provided between the stopper layer and the ohmic layer.
申请公布号 CA2019026(C) 申请公布日期 1998.01.06
申请号 CA19902019026 申请日期 1990.06.14
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 YAMABAYASHI, NAOYUKI;YANO, TAKASHI
分类号 H01L21/28;H01L21/285;H01L23/485;H01L29/43;H01L29/45;(IPC1-7):H01L21/28;H01L21/324 主分类号 H01L21/28
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