发明名称 |
ELECTRODE STRUCTURE FOR III-V COMPOUND SEMICONDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME |
摘要 |
The present invention relates to an electrode structure formed on a III-V compound semiconductor element and a method for manufacturing the same and an object thereof is to provide an electrode which exhibits a high wire bonding strength, a low ohmic contact resistance, and high reliability, and is easy to shape itself. The electrode structure of the present invention is formed by annealing after the formation of a laminated structure having an ohmic layer including at least Ni formed on the III-V compound semiconductor element, a bonding layer to be connected with a bonding wire, a stopper layer provided between the ohmic layer and the bonding layer and an isolation layer provided between the stopper layer and the ohmic layer.
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申请公布号 |
CA2019026(C) |
申请公布日期 |
1998.01.06 |
申请号 |
CA19902019026 |
申请日期 |
1990.06.14 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
YAMABAYASHI, NAOYUKI;YANO, TAKASHI |
分类号 |
H01L21/28;H01L21/285;H01L23/485;H01L29/43;H01L29/45;(IPC1-7):H01L21/28;H01L21/324 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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