发明名称 |
Integrated circuit for directly attaching to a glass substrate and method for manufacturing the same |
摘要 |
An integrated circuit (230) for attaching to a glass substrate (225) includes an integrated circuit die (350) having circuitry formed thereon. The integrated circuit (230) has cavities (380) formed in a first surface, and metal layers (370) formed adjacent to the integrated circuit die (350) and within the cavities (380) are coupled to the circuitry. Conductive bumps (260), which are formed from a material that adheres to glass, are deposited within the cavities (380) and electrically coupled to the circuitry via the metal layers (370).
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申请公布号 |
US5705855(A) |
申请公布日期 |
1998.01.06 |
申请号 |
US19960709421 |
申请日期 |
1996.09.06 |
申请人 |
MOTOROLA, INC. |
发明人 |
CARSON, ROBERT THOMAS;RECKLEBEN, LISA;ZHONG, DAWN HE;HOGREFE, JR., ARNOLD WILLIAM;JOSLIN, SCOTT LAWRENCE |
分类号 |
G02F1/13;H01L21/60;H01L23/485;(IPC1-7):H01L23/48;H05K7/02 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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