发明名称 CHEMICAL MACHINE POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To uniformly polish a plural number of workpieces by simultaneously applying uniform pressure on all of the workpieces by using a plural number of holding bodies of the workpieces. SOLUTION: Each of a plural number of holding bodies 6 of workpieces has an elastic thin film 13 forming a pressure fluid chamber 14 respectively by receiving pressure fluid of water, air, etc., and a workpiece W is held on the side of a lower surface of the elastic thin film 13. Each of the pressure fluid chambers 14 is communicated to each other through a solid chamber 16 having larger capacity than the pressure fluid chamber. It is possible to flatten each of the workpieces W as equalization of surfaces to be polished of the workpieces W is automatically carried out, equally distributed pressure is applied, the same pressure is simultaneously applied on all of the workpieces W and the surfaces to be polished of a plural number of the workpieces W are polished with uniform working pressure.
申请公布号 JPH10552(A) 申请公布日期 1998.01.06
申请号 JP19960168320 申请日期 1996.06.07
申请人 CANON INC 发明人 TAKAHASHI KAZUO
分类号 B24B37/005;B24B37/30;H01L21/304 主分类号 B24B37/005
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