| 摘要 |
A shield (50) for use in wave soldering processes to selectively affix solder to an area of circuit board (20), having one or more electronic components (21) on the solder side of the board, is disclosed. Shield (50) includes a generally planar base member (51) of low thermal conductivity which forms the foundation of shield (50). Marginally disposed registration ridges (54) are formed on the upper surface (52). Registration ridges (54) serve to hold circuit board (20) against shield (50) in a fixed position. Ridges (54) are positioned to closely receive the peripheral edges of circuit board (20). One or more solder flow openings (56) are formed through base member (51) extending from upper side (52) to lower side (53). Solder flow openings (56) are positioned to align with the selected areas of circuit board (20) to which solder is to be affixed. One or more recesses (55) are provided in the upper surface (52) of base member (51) to receive and shield electronic components (21).
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