LEAK COLLET AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To avoid the upwash of solder after releasing vacuum. SOLUTION: A recess 22 having tapered inner surface is provided in a collet 21 vacuum sucking a semiconductor pellet or an insulating substrate 5 packaged with a plurality of circuit elements so as to mount this pellet or the insullating substrate 5 on a substrate 3 such as a heat sink, while a through hole 23 penetrating to the recess 22 is provided at least on one side of the collet 21.