| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead frame, which ensures adhesiveness with sealing resin even when the rear face of the semiconductor element is exposed and eliminates an area not filled with the resin in resin sealing, and provide a semiconductor device using it and the manufacture of the lead frame. SOLUTION: A lead frame composed of four small die pad parts, which are bonding parts 19a, 19b, 19c and 19d, and a die pad part 16 which is smaller than a semiconductor element to be mounted is used. Thus, stress due to sealing resin is modified, a quantity of adhesive applied on the die pad part 16 for bonding the semiconductor element with the die pad part 16 is reduced at the time of mounting the semiconductor element, a quantity of water absorption is reduced, and package cracks, etc., are prevented in the reflow process. Prior to die bonding, the rear face of the semiconductor element is cleaned by ultraviolet and the pressure sensitive adhesive of a pressure sensitive adhesive sheet used in dicing is removed. Therefore, the rear face of the element is not contaminated, and adhesiveness with the sealing resin is ensured.</p> |
