| 摘要 |
PROBLEM TO BE SOLVED: To provide a fine pattern defect inspecting device which has high processing speed, a simple apparatus structure, and a small size. SOLUTION: This device carries out defect inspection for a pattern of an inspection chip 105 by comparing the pattern image data of the inspection chip 105 having a fine logic pattern formed on a wafer 1112 with the pattern image data of a reference chip 104. In this case, a photodetector 102 for an objective chip and a photodetector 101 for a reference chip are so moved independently in the x- and y-axis directions as to conform the pattern image data of the objective chip 105 and the pattern image data of the reference chip 104 and a defect image is thus detected without requiring computing process for correction for position shift for every alteration of inspection regions. |
