| 摘要 |
PROBLEM TO BE SOLVED: To provide manufacture of a board having solder bump which enables easy control of the dimension of the solder bump. SOLUTION: A 37Pb-63Sn eutectic solder paste 25 is squeegee-printed to an intaglio 23 of stainless steel on which concaved portions 21 are formed in the same array as pads 17. Then, the intaglio 23 is set on the upper surface of a wiring beard 3 with the recessed portions 21 facing downward. At this point, the intaglio 23 is set in such a manner that the pads 17 and the concaved portion 21 coincide with each other. Then, the intaglio 23 set on the wiring board 3 is located in a reflow furnace, where the intaglio is heated to a temperature 10-40 deg.C higher than the melting point of the solder and is then cooled. Thus, a plurality of solder bumps 1 having the same height and having their top portions flattened are formed on the pads 17 of the wiring board 3. |
