| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing multilayer substrate capable of reducing the wiring resistance value. SOLUTION: A hybrid IC is formed into a multilayer substrate 2 by laminating five aluminas of insulating layers 1a, 1b, 1c, 1d, 1e. In such a constitution, an inner layer wiring through trench 3a is formed by press-machining process in the insulating layer 1b of the multilayer substrate 2 so that this trench 3a may be filled up with an inner layer wiring material 4 by forcible inserting process or printing process. Likewise, another inner layer wiring through trench 3b is formed in the insulating layer 1c of the multilayer substrate 2 by the press-machining process so that this inner layer wiring through trench 3b may be filled up with the inner layer wiring material 4 by the forcible inserting process or the printing process. |
