发明名称 Electroplating apparatus
摘要 PCT No. PCT/GB94/02398 Sec. 371 Date Jun. 26, 1996 Sec. 102(e) Date Jun. 26, 1996 PCT Filed Nov. 4, 1994 PCT Pub. No. WO95/12696 PCT Pub. Date May 11, 1995There is disclosed apparatus for selectively electrolytically treating defined regions of a continuously moving conductive workpiece. The apparatus comprises means for conveying the workpiece through an electrolytic treatment zone of the apparatus where it is contacted with a treatment electrolyte; the conveying means affording masking means to mask the workpiece so that electrolyte contacts only the defined regions; the conveying means comprising an endless chain affording indexing means by which the workpiece is located in register with the masking means; means for supplying electrolyte to the masked workpiece; and means for passing a current between the workpiece as one electrode and another electrode; the means for conveying the workpiece comprising two endless chain conveyors made of articulated links of electrically non-conductive material between which the workpiece is held whilst it is passed through the treatment zone. Indexing means may be provided for ensuring that the two endless chain conveyors remain in register with each other at least in the treatment zone.
申请公布号 US5705043(A) 申请公布日期 1998.01.06
申请号 US19960637820 申请日期 1996.06.26
申请人 SUNTEC TRADING AG 发明人 ZWERNER, ERIC;APARICIO, MARIANO
分类号 C25D5/02;(IPC1-7):C25D17/00 主分类号 C25D5/02
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