| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which causes less recognition errors in performing picture recognition for positioning a semiconductor substrate at the time of wire bonding or dicing. SOLUTION: On a semiconductor chip 1 having a memory cell portion 2, a peripheral circuit portion, a bonding Al pad 3, a test Al pad 3a and a check electrode 4 provided thereon, an overcoat film 5 made of polyimide is provided except for portions corresponding to the Al pads 3, 3a and the check electrode 4 and portions corresponding to regions 6a, 6b used for picture recognition at the time of positioning. The regions 6a, 6b used for picture recognition are selected to be a region including one corner of the semiconductor chip 1 in such a manner that the region does not cover the memory cell portion 2 on the semiconductor chip 1, and a region including another corner which is diagonally facing the one corner on the semiconductor chip 1.</p> |
