发明名称 |
METHOD FOR MOLDING PLASTIC AND ITS APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To make a substrate both inner and outer peripheral parts of which have a uniform transfer property be obtained by molding with an insulating effect by an insulating part or layer changed corresponding to the position in a cavity. SOLUTION: A ceramic insulating material 13 is used, and its thickness is changed to increase corresponding to the distance from from a gate. The material 13 is fixed to a movable core 5 with an epoxy adhesive. In this way, the temperature of the interface between it and a stamper 4 immediately after resin packing is more than or equal to the heat distortion temperature of a resin even in the peripheral part of a substrate in which the temperature of the molten resin immediately after packing becomes lower than that of the inner peripheral part of the substrate close to a gate, and the temperatures of the inner peripheral part of the substrate and the outer peripheral part become the same. A good transfer property is obtained in both inner and outer peripheral parts by molding by such a molding mold. |
申请公布号 |
JPH10626(A) |
申请公布日期 |
1998.01.06 |
申请号 |
JP19960153676 |
申请日期 |
1996.06.14 |
申请人 |
HITACHI LTD;HITACHI MAXELL LTD |
发明人 |
YOSHII MASAKI;KURAMOTO HIROKI;FUJIKAWA KAZUHIRO |
分类号 |
B29C33/38;B29C45/26;B29C45/73;B29L17/00;(IPC1-7):B29C33/38 |
主分类号 |
B29C33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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