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发明名称
RESIN MOLDING APPARATUS
摘要
申请公布号
JPH10656(A)
申请公布日期
1998.01.06
申请号
JP19960153638
申请日期
1996.06.14
申请人
NEC CORP
发明人
OTAKA KODAMA
分类号
B29C33/76;B29C45/26;B29C45/27;B29C45/33;B29C45/40;(IPC1-7):B29C45/26
主分类号
B29C33/76
代理机构
代理人
主权项
地址
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