| 摘要 |
A Peltier cooler includes a plurality of Peltier elements, first and second ceramic substrates that are disposed to hold the Peltier elements through metallized electrodes formed inside the ceramic substrates and to electrically connect the Peltier elements in series, and first and second metal substrates respectively fixed to the first and second ceramic substrates by brazing, so as to hold them. The metal substrates are fixable to a substrate on which optical components are mounted and a semiconductor laser package, by yttrium-aluminum-garnet (YAG) laser welding. The YAG laser welding and the brazing operation eliminate the use of low-temperature solder, where creeps may occur.
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