发明名称 METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing ceramic electronic components, preventing yield deterioration due to chipping, crack or break of chips which have orientation. SOLUTION: A mother block 1 for forming multiple ceramic electronic components is burned and scribed for forming primary breaking grooves 2 in a predetermined direction. Then the mother block 1 is broken along the primary grooves 2 to form multiple stick-like aggregates 4. Outer electrodes are formed on the aggregates 4. In the breaking grooves forming process, secondary breaking grooves 3 crossing the primary breaking grooves 2 are formed by a scribing method. After forming the outer electrodes 5, the aggregates 4 of are divided into multiple pieces along the secondary breaking grooves 3 with keeping the direction of the outer electrodes 5.
申请公布号 JPH104024(A) 申请公布日期 1998.01.06
申请号 JP19960175765 申请日期 1996.06.14
申请人 MURATA MFG CO LTD 发明人 OKUYAMA SHINGO;NAKAGAWA TADAHIRO;ARISHIRO MASATOSHI
分类号 H01G4/12;H01F41/04;H01G4/00;H01G13/00 主分类号 H01G4/12
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