Semiconductor casing with bottom leads

摘要

The device has numerous inner leads (25) which extend from the corresponding outer ones (23), which are folded over corresponding surface of the outer feeds. On the top surface of each inner lead, a semiconductor chip (29) is secured by means of an insulating adhesive (27). The chips are coupled to the inner leads by conductive wires (31). A part of the casing, surrounding all of the components, is embedded in a casing substance (33), leaving the downward bent ends (23b) of the outer leads free. Preferably the lower surface of the outer leads contains a groove (23a).