| 摘要 |
<p>In a semiconductor device, a pellet electrode (20), which is formed on a mesa-shaped pellet (100), and an external electrode (26), with which a package is provided, are in pressure-contact with each other. A soft-metal plate (30) which has projections (31) along its surface is arranged between the external (26) electrode and the pellet electrode (20). <IMAGE></p> |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP |
发明人 |
HIYOSHI, MICHIAKI, C/O INTELLECTUAL PROPERTYDIV., MINATO-KU, TOKYO 105, JP;FUJIWARA, TAKASHI, C/O INTELLECTUAL PROPERTY DIV., MINATO-KU, TOKYO 105, JP;SUZUKI, HISASHI, C/O INTELLECTUAL PROPERTY DIV., MINATO-KU, TOKYO 105, JP;MATSUDA, HIDEO, C/O INTELLECTUAL PROPERTY DIV., MINATO-KU, TOKYO 105, JP |
