LEADFRAME FOR THE ASSEMBLY OF AN INTEGRATED CIRCUIT IN AN INJECTION MOUNDED HOUSING

摘要

The leadframe (1) has a resilient member (6) which can be compressed by an injection moulding tool (7a, 7b) when the housing (5) is being injection moulded. As a result of the resilience thus produced, a contact face (3) of the lead (2) can be pressed against an interior wall (8) of the injection moulding tool (7a, 7b). The invention offers the following advantages: the formation of a plastic flash on the contact face (3) is prevented, the lead (2) is secured during the injection process, and the lead (2) is anchored in the completed housing (5). There is no need for clamping pins inside the injection moulding tool (7a, 7b).