摘要 |
<p>A radiation-curable silicone release composition is described which comprises (A) a mixture of organopolysiloxanes characterized by the formula (I): RSi(CH3)2-O-(Si(CH3)2O)n(Si(CH3)(R)O)mSi(CH3)2R wherein the mixture comprises (A-1) from about 25 percent to 95 percent by weight of at least one organopolysiloxane characterized by formula (I) wherein each R is -R1-O(O)C-C(R2)=CH2, R1 is a hydrocarbylene group, R2 is hydrogen or a methyl or ethyl group, m is a number from about 1 to about 15, and n is a number from about 50 to about 300, and (A-2) from about 5 percent to 75 percent by weight of at least one other organopolysiloxane characterized by formula (I) wherein R is -R1-OCH2CH(OH)-CH2O(O)C-C(R2)=CH2, R1 is a hydrocarbylene group, R2 is hydrogen or a methyl or ethyl group, m is a number from about 1 to about 25, and n is a number from about 50 to about 300, and (B) from 0 percent to about 5 percent by weight of a photoinitiator. A method of producing silicone release-coated substrates, the release-coated articles thus produced, and multi-layer articles or constructions incorporating a silicone-release layer also are described. When the silicone compositions are cured such as by electron beam radiation, the cured compositions exhibit a desirable high and controlled release force at high speeds such as the speeds utilized in label processing.</p> |