| 摘要 |
<p>Disclosed is a technique for producing a multiple element SMD passive circuit device (200) having formed thereon a plurality of passive circuit elements (206) including waferwise forming a multiplicity of groups of passive circuit elements on a wafer, each group including a plurality of passive circuit elements having contact pads (214), waferwise forming SMD connection pads by depositing conductive material over the wafer in electrical conductive engagement with the passive circuit elements, and thereafter dividing the wafer into a multiplicity of multiple element SMD passive circuit devices.</p> |
