发明名称 |
Semiconductor integrated circuit device and method of producing the semiconductor integrated circuit device |
摘要 |
A semiconductor integrated circuit device includes a semiconductor chip supported by a stage, leads electrically connected to the semiconductor chip, first and second heat radiating members provided on first and second sides of the semiconductor chip, and a resin package body completely sealing the semiconductor chip and partially sealing the leads and the first and second heat radiating members.
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申请公布号 |
US5703398(A) |
申请公布日期 |
1997.12.30 |
申请号 |
US19960667326 |
申请日期 |
1996.06.20 |
申请人 |
FUJITSU LIMITED;FUJITSU AUTOMATION |
发明人 |
SONO, MICHIO;TSUJI, KAZUTO;SAKODA, HIDEHARU;SUZUKI, YOSHIMI;SAKUMA, MASAO |
分类号 |
H01L23/29;H01L21/56;H01L23/433;H01L23/50;(IPC1-7):H01L23/10;H01L23/34 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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