发明名称 Method for forming intermetal dielectric with SOG etchback and CMP
摘要 A defect free intermetal dielectric, IMD, and method of forming the defect free IMD are described. The IMD uses spacers formed by means of etchback of a layer of spin-on-glass, SOG. In order to use an oxide layer formed by means of plasma enhanced tetra-ethyl-ortho-silicate, PE-TEOS, as part of the IMD an oxide cap layer formed using plasma enhanced chemical vapor deposition, PE-CVD, is used to isolate the SOG spacers from the PE-TEOS formed oxide layer. By isolating the PE-TEOS formed oxide layer from the SOG spacers a reliable and defect free IMD is achieved.
申请公布号 US5702980(A) 申请公布日期 1997.12.30
申请号 US19960616415 申请日期 1996.03.15
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD 发明人 YU, CHEN-HUA DOUGLAS;JANG, SYLIN-MING
分类号 H01L21/768;H01L23/532;(IPC1-7):H01L21/28 主分类号 H01L21/768
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