| 摘要 |
An anode/anode bonding material for anode to anode material bonding in SOFC stacks, and an anode/interconnect bonding material for anode material to interconnect material bonding in SOFC stacks are provided. The anode/anode bonding material comprises powders of reactive ingredients, nickel oxide and zirconium oxide as the major components. The anode/interconnect bonding material comprises powders of reactive ingredients, nickel oxide, zirconium oxide, cobalt oxide, calcium oxide or strontium oxide as the major components. The reactive ingredients are selected from the compounds of tungsten, tantalum, niobium, molybdenum, and titanium. During the bonding operation at subsintering temperatures of 1000 DEG -1300 DEG C. the bonding materials react with anode and/or interconnect material to provide strong and reliable anode to anode bonds and/or anode to interconnect bonds that have a bonding strength greater than one megapascal. The respective bonds are compatible with anode and interconnect materials and are electrically conductive in SOFC operating environments.
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