| 发明名称 |
TAB tape and semiconductor device using the TAB tape |
| 摘要 |
In a TAB tape, dummy copper foil patterns (10, 10a, 10b) are provided on the portions of an adhesive (14) on which neither pads (11) nor leads (12) are provided, thereby flattening the upper surface of solder resist (13) coated on the resultant structure. <IMAGE> |
| 申请公布号 |
EP0814510(A2) |
申请公布日期 |
1997.12.29 |
| 申请号 |
EP19970110042 |
申请日期 |
1997.06.19 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
IKEMIZU, MORIHIKO;OKUTOMO, TAKAYUKI;FUKUOKA, YUTAKA;TAKEUCHI, MASAFUMI |
| 分类号 |
H01L21/60;H01L21/603;H01L23/12;H01L23/495;H01L23/498;H05K1/00;H05K3/34 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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