MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

A thick isolation oxide film is selectively formed on a surface of a silicon substrate so as to isolate an element formation region. Ions are implanted into a region in silicon substrate through the thick isolation oxide film. Thus, retrograde wells, having impurity concentration peak positions are formed in the region of silicon substrate positioned under the isolation oxide film. Then, an upper part of the isolation oxide film is removed away to form an isolation oxide film with a reduced thickness. Isolation oxide film has a reduced isolation length L. Thus, a semiconductor device is provided, which permits restriction of the narrow channel effect and the substrate biasing effect when the size of elements is reduced.