SEMICONDUCTOR PACKAGE

摘要

A semiconductor BGA(ball grid array) package is provided to improve radiation of heat using a radiant heat plate. The BGA package is integrated in a chip(3) on PCB(print circuit board)(2) having a radiant heat groove(1) by flip chip method. The chip(3) and the PCB(2) are connected to a lead ball(5). A radiant heat plate(6) is formed on the chip(3). The one surface of the radiant heat plate(6) is connected to the chip(3) and the other surface of the radiant heat plate(6) is exposed on the BGA package. Thereby, it is possible to stabilize compared to the conventional wire connecting method..