| 摘要 |
A plastic semiconductor package and the method for fabricating a plastic semiconductor package comprises a semiconductor chip(11), a cavity(12a) for bonding the semiconductor chip(11), a plastic molded package body for arranging a plurality of leads(12b) for wire bonding on the semiconductor chip(11) around the cavity(12a), a plurality of metal wires(13) for electrically connecting the semiconductor chip(11) with the leads(12b), a shielding tissue(14) for surrounding the upper portion of the cavity(12a). Thereby, some of fabricating steps can be reduced, so that a fabricating coat is significantly reduced.
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