Heat sink for electronic component

摘要

The heat sink of a type used with electrical components is produced of a material with good thermal conductivity and has a rectangular profile with a series of parallel heat dissipating fins (10) projecting from the underside. The top surface has a material layer (100) and this is covered by a protective film (110). The material layer is of a thermal fat that can be of a conductive powder in a gel. In an alternative form the material covers partial contact areas of the heat sink.