| 摘要 |
PCT No. PCT/DE89/00781 Sec. 371 Date Apr. 20, 1992 Sec. 102(e) Date Apr. 20, 1992 PCT Filed Dec. 21, 1989 PCT Pub. No. WO90/07398 PCT Pub. Date Jul. 12, 1990.A process for treating workpieces by means of laser radiation, particularly for the cutting, hole burning and material removal with respect to metallic workpieces, in which the treated site of the workpiece is monitored by a radiation detector which contributes to reducing the intensity of the laser radiation when an upper limit value is reached and to increasing it when a lower limit value is reached. In order to achieve a controlled process without exceeding a critical temperature, such as the evaporation temperature, in a simple manner, the process is carried out such that, by the radiation detector, the heat radiation is measured which emanates from its treatment site, by which an upper temperature is monitored as the upper limit value of a predetermined temperature range and a lower temperature is monitored as the lower limit value of this temperature range, and in that the laser radiation, when the upper limit value is reached, is switched off and is switched on again when the lower limit value is reached. |
