Method for manufacturing an insulating trench in an SOI substrate for smartpower technologies

摘要

A method for producing an insulating trench in an SOI substrate having integrated logic elements and high-voltage power components is provided. A trench extending down to an insulating layer is etched and covered with a doped silicon structure. Diffusion regions neighboring the trench are produced by drive-out from the doped amorphous silicon structure and an insulation structure is simultaneously produced in the trench by oxidation of the doped silicon structure.