| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a package which can withstand external forces and requires a small area, by solving such a problem encountered with the conventional package that leads are easily deformed and the size of the package increases as a whole by the protruded amounts of the leads. SOLUTION: A resin or a ceramic package 1 of a semiconductor device is provided with grooves 6 which are provided on the side faces of the package 1 in the vertical direction and reach the upper or lower surface of the package 1, and leads 2 which are led out from the grooves 6 and bent along the grooves in a state where the leads 2 are protruded partially from the openings of the grooves 6 by amounts which are smaller than the thicknesses of the leads 2, so that the leads 2 can be connected to the outside and the remaining parts of the leads 2 can be housed in the grooves 6.</p> |
