| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor device in which the heat dissipation properties can be enhanced easily without modifying the manufacturing process. SOLUTION: The resin sealed semiconductor device comprises a semiconductor element 1, an element mounting part 2, and thin metal lines 4 molded of an epoxy resin and covered with a resin sealing part 5. Leads 3a, 3b, 3c are led out from the resin sealing part 5 and each lead is provided, at a part on the board inserting side, with heat dissipation parts 7a, 7b, 7c which are 2-3 times wider than other part.</p> |
