| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, and a manufacturing method, which is provided with a light transmission window for protecting the optical characteristics against defect due to adhesion of a dicing chip or a chip generated during other assembling step to a light receiving part. SOLUTION: A silicon layer is bonded onto a wafer 1 provided with a light receiving part to form a transparent cap 2 and then the silicon is removed from the pad 3 and the region of scribe line 4. The wafer is then diced and a chip 1a is mounted on a lead frame 6 through an adhesive 5. Subsequently, the pad 3 on the chip 1a is connected through a bonding wire 7 with a predetermined inner lead of the lead frame 6. Finally, it is resin-sealed 8 except the light receiving part. |
