| 摘要 |
PROBLEM TO BE SOLVED: To easily and inexpensively package an integrated circuit. SOLUTION: A method for packaging integrated circuit device includes a sealing process in which a resin 5 is formed in the other area than pads 2 on the surface of a chip 1 and a paste sticking process in which conductive paste is formed on the pads 2 by bringing the paste 7 into contact with the pads 2. The exposed areas of the paste 7 can be made larger than the surface areas of the pads 2 or can be formed in prescribed patterns. The paste 7 is composed of a thermoplastic or thermosetting conductive material. In addition, silver and/or copper can be used as the conductive material contained in the paste 7. Therefore, inexpensive chip connecting terminals can be obtained easily in place of expensive bumps which are hard to be formed. Since it is not required to use solder as the paste 7, a solder-free condition which is desirable under the present lead regulating condition can be accomplished on a package and board assembly. |
