| 摘要 |
PROBLEM TO BE SOLVED: To perform the measurement of every measured objects for a short time within the minimum and optimum measurement range, by setting the measurement range in the optical axis direction, corresponding to the error on every measured objects, and measuring the height of the measured object on a stage within the measurement range by a confocal optical unit. SOLUTION: The height of one representative point of a wafer 6a placed on aθtable 12 is measured, when only the error of thickness of every wafers 6a has the problem. The measurement thereafter is performed in the condition that the optimum measurement range S1 is shifted by the amount of the error to the standard wafer thickness, by measuring the error to the standard thickness of the wafer 6a by the measurement of the height. Then the surface heights of representative points P1-P3, of the wafer 6a are measured, when the errors of the inclination and the thickness of the wafer 6a on theθtable 12 have the problem. Thereby the inclination of the wafer 6a can be measured with the error of the thickness, so that the measurement is performed in a condition that the optimum measurement range S1 is shifted by the amount of error to the standard thickness.
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