| 摘要 |
<p>PROBLEM TO BE SOLVED: To suppress defective bonding by setting the leads for starting and ending the coating of adhesive varnish wider than other inner leads. SOLUTION: The lead frame for semiconductor device has inner leads 20-1 ,..., 20-5 coated with an adhesive varnish in the region for mounting a semiconductor chip. The width W1 of the first and end leads 20-1 , 20-5 is set at least 1.3 times wider than the width W2 of other inner leads 20-2 ,..., 20-4 in order to suppress fluctuation of the coating.</p> |
