| 摘要 |
PROBLEM TO BE SOLVED: To improve heat dissipation from the lower surface of a semiconductor chip mounted on a main circuit board through a sub-circuit board in a semiconductor device provided with a resin sealing material between the semiconductor chip and the sub-circuit board. SOLUTION: A heat absorbing part 33 is provided on a sub-circuit board 31 under a semiconductor chip 51. Heat generated from the lower surface of the semiconductor chip 51 is absorbed by the heat absorbing part 33 and conducted through a heat conducting part 37 provided in the sub-circuit board 31 or a heat conducting part 67 provided in a main circuit board 61 to a heat dissipating part 65 provided on the lower surface of the main circuit board 61. |
