| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame and a lead frame member of copper alloy in which delamination due to formation of a copper oxide on the surface of the lead frame can be prevented regardless of the assembling conditions of an IC without sacrifice of bondability. SOLUTION: The lead frame made of a copper alloy is provided with a die pad 111 for mounting a semiconductor element and subjected to partial plating of a noble metal 150 for wire bonding or die bonding. The die pad 111 is subjected, at least on the rear side where the semiconductor element is not mounted, to electroless copper plating 140 at a surface roughness Ra of JIS B0601 in the range of 0.05-0.1μm. |
